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A1D00119619

A1D00119619

Manufacturer: SIEMENS

Price: On Request

Measurement device for inspection of the coplanarity on the leads of IC. For use with Twin Head for SIPLACE HF and HF/3. SW 505 or higher. Only in the second placement area.

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A1D00119614 A1D00119614 Transportheight 950mm for SIPLACE X-Series/D3 placement stations. Item No for configuration. A later change brings extra costs on enquiry.
A1D00119615 A1D00119615 6-Segment Collect and Place Head for SIPLACE HF-Series. This head can be used for replacing an Twin Head. The Head Modularity allows the custome r to define the head configuration to his actual needs. With this head a component range from 1.6mm x 0.8mm (0603) to 32mm x 32mm can be handled . A maximum component height of 8.5mm is possible. Max. BE Mass: 5gr.. P rogrammable placement force: 2.4N-5.0N. Min. Pitch for Lead ca. Bump: 50 0um / 350um. Min. Bump : 200um. FOV BE-Camera: 39.0mm x 39.0mm.
A1D00119616 A1D00119616 12-Segment Collect and Place Head for SIPLACE HF-Series. The Head Modula rity allows the customer to define the head configuration to his actual needs. With this head a component range from 0.6mm x 0.3mm (0201) to 18. 7mm x 18.7mm can be handled. A maximum component height of 6mm is possib le. Max. component weight: 2gr.. Programmable placement force: 2.4N-5.0N . Min. Pitch for Lead ca. Bump: 500um / 350um. Min. Bump: 200um. FOV Com ponent-Camera: 24.0mm x 24.0mm.
A1D00119618 A1D00119618 Additional stationary component camera module for the SIPLACE Twin Head for flip chip bump centering. Field of view: 11mm x 11mm. Largest flip chip with single measurement: 8mm x 8mm. Smallest, reliably recognizable bump diameter: 0.08mm. Reliable processing of ball pitch: 0.135mm lead pitch: 0.25mm.
A1D00119619-01 A1D00119619-01 Measurement device for inspection of the coplanarity on the leads of IC. For use with Twin Head for SIPLACE HF and HF/3. SW 505 or higher. Only in the second placement area.
A1D00119620 A1D00119620 SIPLACE Twin Head for SIPLACE HF-Series placement stations. The Twin Hea d consist of two autonomous working Pick and Place Modules. Included in delivery are the IC-Camera and 1 Nozzle changer with 3 Standard nozzle m agazine (item no.:03005191) for each 2 nozzles and 1 Soko Nozzle magazi ne (item no.:03001807). The Head Modularity allows the customer to defin e the head configuration for placement area 1 to his actual needs. For p lacement area 2 this head is the Standard configuration. With this head a component range from 0.6mm x 0.3mm (0201) to 50mm x 50mm or to 69mm x 10mm to 85mm x 85mm (Single Nozzle Operation). A maximum component heigh t of <= 25mm is possible. Max. component weight: 30gr. (Standard), 100gr .(with reduced speed). Programmable placement force: 0.5N-15N. Nozzle di stance: 70.8mm. Camera: 79µm / Pixel. Min. Bump: 320µm.
A1D00119621 A1D00119621 The Twin Head Re-Configuration Kit is necessary to exchange the actual C ollect and Place Head,of the SIPLACE HF-Series,in a Twin Head. The Kit i ncludes: 2 Pick and Place Modules, Stationer Component-Camera, a nozzle changer with 3 Dual Garage Magazine and 1 Single Garage Magazine, Cover, Head Servo Cards, Head Adapter board, Cables, additional parts, Tools f or Head exchange, Box for replaced Head and a Technical Manual. With thi s kit the Head exchange can be performed by trained service personnel at customer side within 8 hours.The customer service isn't included in thi s price.
A1D00119621-01 A1D00119621-01 The Twin Head Re-Configuration Kit is necessary to exchange the actual Collect and Place Head,of the SIPLACE HF-Series,in a Twin Head. The Kit includes: 2 Pick and Place Modules, Stationer Component-Camera, a nozzle changer with 3 Dual Garage Magazine and 1 Single Garage Magazine, Cover, Head Servo Cards, Head Adapter board, Cables, additional parts, Tools for Head exchange, Box for replaced Head and a Technical Manual. With this kit the Head exchange can be performed by trained service personnel at customer side within 8 hours.The customer service isn't included in this price.