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A1D00119621

A1D00119621

Manufacturer: SIEMENS

Price: On Request

The Twin Head Re-Configuration Kit is necessary to exchange the actual C ollect and Place Head,of the SIPLACE HF-Series,in a Twin Head. The Kit i ncludes: 2 Pick and Place Modules, Stationer Component-Camera, a nozzle changer with 3 Dual Garage Magazine and 1 Single Garage Magazine, Cover, Head Servo Cards, Head Adapter board, Cables, additional parts, Tools f or Head exchange, Box for replaced Head and a Technical Manual. With thi s kit the Head exchange can be performed by trained service personnel at customer side within 8 hours.The customer service isn't included in thi s price.


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A1D00119618 A1D00119618 Additional stationary component camera module for the SIPLACE Twin Head for flip chip bump centering. Field of view: 11mm x 11mm. Largest flip chip with single measurement: 8mm x 8mm. Smallest, reliably recognizable bump diameter: 0.08mm. Reliable processing of ball pitch: 0.135mm lead pitch: 0.25mm.
A1D00119619 A1D00119619 Measurement device for inspection of the coplanarity on the leads of IC. For use with Twin Head for SIPLACE HF and HF/3. SW 505 or higher. Only in the second placement area.
A1D00119619-01 A1D00119619-01 Measurement device for inspection of the coplanarity on the leads of IC. For use with Twin Head for SIPLACE HF and HF/3. SW 505 or higher. Only in the second placement area.
A1D00119620 A1D00119620 SIPLACE Twin Head for SIPLACE HF-Series placement stations. The Twin Hea d consist of two autonomous working Pick and Place Modules. Included in delivery are the IC-Camera and 1 Nozzle changer with 3 Standard nozzle m agazine (item no.:03005191) for each 2 nozzles and 1 Soko Nozzle magazi ne (item no.:03001807). The Head Modularity allows the customer to defin e the head configuration for placement area 1 to his actual needs. For p lacement area 2 this head is the Standard configuration. With this head a component range from 0.6mm x 0.3mm (0201) to 50mm x 50mm or to 69mm x 10mm to 85mm x 85mm (Single Nozzle Operation). A maximum component heigh t of <= 25mm is possible. Max. component weight: 30gr. (Standard), 100gr .(with reduced speed). Programmable placement force: 0.5N-15N. Nozzle di stance: 70.8mm. Camera: 79µm / Pixel. Min. Bump: 320µm.
A1D00119621-01 A1D00119621-01 The Twin Head Re-Configuration Kit is necessary to exchange the actual Collect and Place Head,of the SIPLACE HF-Series,in a Twin Head. The Kit includes: 2 Pick and Place Modules, Stationer Component-Camera, a nozzle changer with 3 Dual Garage Magazine and 1 Single Garage Magazine, Cover, Head Servo Cards, Head Adapter board, Cables, additional parts, Tools for Head exchange, Box for replaced Head and a Technical Manual. With this kit the Head exchange can be performed by trained service personnel at customer side within 8 hours.The customer service isn't included in this price.
A1D00119622 A1D00119622 Component feeder changeover table, height 830-950mm, with integrated reel container. For SIPLACE HF/X-Series/D3.Component feeder capacity (Typ S): 15 slots. With wheels for minimization of setup times.
A1D00119623 A1D00119623 An additional mechanical device to avoid incorrect feeder stand on changeover table due to improper operator handling. The mechanical attachment is required per HF/X-Series/D1/D2/D3 component feeder changeover table (119622,119755). The additional feeder fastening attachment accommodates all SIPLACE HF-Series feeders delivered since CW 34/98. Please pay attention to the preconditions which are discribed in the Product Status Report for all feeders delivered before CW 34/98.
A1D00119625 A1D00119625 Modular single conveyor for SIPLACE X-Series/D3. PCB-dimensions (L x W) Standard: 50mm x 50mm (2 inch x 2 inch) up to 450mm x 460mm (17.7 inch x 18 inch). Configuration (item no.:119629) 250mm-508mm.(Please fix the configuration with the order). Extended dimensions with the Long Board Option: 610mm x 460mm(508mm). Item has to be ordered with the placement station. With this new transport the PCB is clamped to top side, that means the component height is no more dependent from PCB-Thickness. The new transport offers short PCB change time and the possibility to change easily the fixed rail Right <-> Left.