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A1D00116963-01

A1D00116963-01

Manufacturer: SIEMENS

Price: On Request

Protection Shield SIPLACE Placement stations 11-20 feeder locations.

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A1D00116969-01 A1D00116969-01 .
A1D00117010 A1D00117010 Dip module for the application of flux or electrically conductive adhesive onto flip chip bumps or CSP balls. The module covers 3 feeder slots (30mm each). The Dip-Module can only be used on the following placement stations: SIPLACE F5 HM ex station computer software version 407.02, SIPLACE S-27 HM ex station computer software version 505.01, SIPLACE HF/D-Serie ex station computer software version 505.01. Standard 25um-75um, Spacer 10um (00378544-01).
A1D00117010S02 A1D00117010S02 DIP MODULE FOR THE APPLICATION OF FLUX OR ELECTRICALLY CONDUCT IVEADHESIVE ONTO FLIP CHIP BUMP S OR CSP BALLS. THE MODULE COVE RS 3 FEEDERSLOTS (30MM EACH). T HE DIP-MODULE CAN ONLY BE USED ON THE FOLLOWING PLACEMENT STAT IONS: SIPLACE F5 HM EX STATI ON COMPUTER SOFTWARE VERSION 40 7.02, SIPLACE S-27 HM EX STATI ON COMPUTER SOFTWARE VERSION 50 5.01, SIPLACE HF-SERIE EX STATI ON COMPUTER SOFTWARE VERSION 50 5.01 .